First, the recognized principle of
Laser Marking Machine has two
1. Hot-processing a laser beam with a higher energy density (which is a concentrated energy flow), illuminating the surface of the material to be processed, absorbing laser energy on the surface of the material, and generating a thermal excitation process in the illumination region, thereby causing the surface of the material (or The coating) rises in temperature, causing metamorphosis, melting, ablation, evaporation, and the like.
2. Cold-working (ultraviolet) photons with high load energy can break the chemical bonds in materials (especially organic materials) or surrounding media to cause non-thermal process damage. This cold working has special significance in laser marking processing because it is not thermal ablation, but cold peeling which breaks the chemical bond without causing side effects of thermal damage, and thus does not heat the inner layer and the vicinity of the surface to be processed. Or thermal deformation and other effects.
Second, laser marking machine common classification
The most common laser marking machines can be divided into:
CO2 Laser Marking Machine, semiconductor laser marking machine, YAG laser marking machine, and
Fiber Laser Marking Machine according to different lasers. According to the different laser visibility, it is divided into: ultraviolet laser marking machine (invisible), green laser marking machine (visible laser), infrared laser marking machine (invisible laser).
1. Lamp-pumped YAG laser marking machine: Xenon lamp is used as the energy source (excitation source), ND:YAG is used as the medium for generating laser light, and the specific wavelength can be emitted to promote the production level transition of the working substance to release the laser, and the laser energy is amplified. A laser beam that is processed into the material is then formed.
2. CO2 laser marking machine: CO2 gas is used to charge the discharge tube as the medium for generating laser light. When a high voltage is applied to the electrode and a glow discharge is generated in the discharge tube, the gas molecules can release the laser light and amplify the laser energy. A laser beam that is processed into the material is then formed.
3. Semiconductor side pump YAG laser marking machine: using a wavelength of 808nm semiconductor laser diode pumped Nd: YAG medium, the medium generates a large number of inverted particles under the action of Q switch to form a giant pulse laser output with a wavelength of 1064nm, electro-optical conversion efficient.
4. Semiconductor end pump YAG laser marking machine: The semiconductor pump light (808 nm) is directly pumped from the end face of the laser crystal, and the laser is output through the optical lens group. The light conversion efficiency is greatly improved.
5, fiber laser marking machine: direct output laser from the fiber.
Third, the distinction of laser marking machine
1. Deep ultraviolet laser marking machine: 266 nm
2, green laser marking machine: 532nm
3, lamp pump YAG laser marking machine: 1064nm
4. Semiconductor side pump YAG laser marking machine, semiconductor end pump YAG laser marking machine: 1064nm
5, fiber laser marking machine: 1064nm
6, CO2 laser marking machine: 10.64um
